PCB Laser Depaneling Services

Advantages of Laser Fpc Cutting/singulation: No mechanical stress on substrates or circuits No tooling cost or consumables. Versatility ? ability to change applications by simply changing settings Fiducial Recognition ? more precise and clean cut Optical Recognition before PCB depaneling/singulation process begins. Ability to depanel virtually any substrate. (Rogers, FR4, ChemA, Teflon, ceramics, aluminum, brass, copper, etc) Extraordinary cut quality holding tolerances as small as < 50 microns. No design limitation ? ability to cut virtually and size PCB board including complex contours and multidimensional boards Challenges of Depaneling using Routing/Die Cutting/Dicing Saws: ? Damages and fractures to substrates and circuits due to mechanical stress ? Damages to PCB due to accumulated debris ? Constant need for new bits, custom dies, and blades ? Lack of versatility ? each new application requires ordering of custom tools, blades, and dies ? Not good for high precision, multi-dimensional or complicated cuts ? Not useful PCB depaneling/singulation smaller boards Lasers, on the other hand, are gaining control of the PCB depaneling/singulation market due to higher precision, lower stress on the parts, and higher throughput. Laser depaneling can be applied to a variety of applications with a simple change in settings. There is no bit or blade sharpening, lead time reordering dies and parts, or cracked/broken edges due to torque on the substrate. Application of lasers in PCB depaneling is dynamic and a non-contact process.

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