Smartphone PCB
ID:186211 View:1224次 |
Date Listed: | 2020-08-17 17:02:04 | Country: | China»Guangdong»Shenzhen |
Poster: | Roger | Company: | Hitech Circuits Co.,Ltd |
Location: | Chuangye Road, Jiangbian Industrial Park, Songgang, Baoan Distirct, Shenzhen, 518105 GuangDong, China. | Website: | Hitech Circuits Co.,Ltd |
Email: | sales1@hitechcircuits.com | Mobile: | +8618316628235 |
Fax: | MSN: |
Technical description Type: Double sides printed wiring board Laminate: FR4 TG170℃ Board size and thickness: 100*36*1.60mm*3UP Surface finished: ENIG Copper thickness: 35um Solder mask : Green Silkscreen : White
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